Die Tying Machines Market Expected to Secure Notable Revenue Share Between 2022 and 2030 – SMU Daily Mustang


According to the Market Statsville Group (MSG), the Global Die Fixing Machine Market was rated at $1,199.0 million in 2021 and should reach $2,042.9 million by 2030recording a 6.1% CAGR from 2022 to 2030. Factors such as growing demand for hybrid circuits for medical, military, photonics, and wireless electronics applications, rising demand for electronic products, and growth in the packaging industry for semi- drivers are driving the growth of the market. However, fluctuating commodity prices are hampering the growth of the market. Furthermore, the growth in the usage of LED circuits offers lucrative growth opportunities for the market player over the forecast period.

Additionally, government policies to promote industries such as automotive and electronics across the globe are driving the demand for the chip attaching machine market. Additionally, increasing demand for LED chips is propelling the growth of chip attaching machine market.

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Additionally, there has been significant growth in the semiconductor industry over the past few years and it is expected to grow significantly in the future. For example, according to data released in July 2020 by the US-based Semiconductor Industry Association on global semiconductor sales, there was a 5.8% increase in semiconductor sales from May 2019 to May 2020. Moreover, according to a report published by Global Semiconductor Trade Statistics in June 2020, the semiconductor industry is expected to register a growth of 6.2% by 2021. These scenarios are expected to boost the growth of the chip attaching machine market over the forecast period.

Global Die Fixing Machines Market Definition

Die Tying Machinealso known as die bonding machine, is installed to attach silicon chip to die cavity or die pad in semiconductor package process.

Global Die Fixing Machine Market Dynamics

Drivers: Growing demand for hybrid circuits for medical, military, photonics and wireless electronics applications

An increase in the demand for hybrid circuits in medical equipment, due to an increase in the number of patients, propels the demand for semiconductor chips. For example, the United Nations estimates that the region’s geriatric population aged 60 and over could grow to around 806.55 million by 2024. Shifting consumer electronics demand is expected to fuel the card market. electrical circuits, which will stimulate the demand for die tying machines.

Constraints: Commodity price fluctuation

Die attaching machines are mostly made from raw materials such as metal, silicon, and plastic. In recent years, the price of these raw materials has fluctuated, due to various economic and speculative factors. Strict government-led laws, tariffs and regulations against deforestation, metals and other materials used in die-fixing machines have drastically reduced manufacturers’ revenues and profits. For example, in 2018 the U.S. government increased metal import tariffs (effective February 2020) by 25% on steel and 10% on aluminum, further driving up the costs of these metals in the United States. Metals and other materials are estimated to limit the market growth over the forecast period.

Opportunities: Growth in the use of LED circuits

With an increase in the penetration rate of LEDs, the demand for die attach equipment is increasing. In the coming years, the assembly of the LED wire link can be used as several methods such as ball and wedge link, chain link and can be interconnected using a link ball to obtain the best result. Countries like China and Japan are the major LED die attach manufacturers. China has the largest number of companies producing die-fixed LEDs, followed by Japan and Europe. Japanese companies are quite strong in technology and have a long history of developing integrated LEDs. The YOLE group is building and expanding its investigations into the memory and hybrid chip industry, which will target mobile, automotive and transport, medical, telecommunications, defense and aerospace. In the future, these countries will build various photonics and sensing devices such as lighting, imaging and display, which will create opportunities in the embedded LED tools market.

Scope of the Global Die Fixing Machines Market

The study categorizes the Die Fixing Machine market on the basis of components, technique, and application regionally and globally..

By Outlook component (Sales, million USD, 20172030)

  • Flip Chip Bonder
  • Die Bonder

By Technical Insights (Sales, million USD, 20172030)

  • Epoxy
  • soft solder
  • Sintering
  • Eutectic
  • Others

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By Outlook app (Sales, million USD, 20172030)

  • RF and MEMS
  • Optoelectronics
  • Logic
  • Memory
  • CMOS image sensors
  • LEDs
  • Others

Outlook by region (Sales, million USD, 20172030)

  • North America
  • Europe
    • Germany
    • Italy
    • France
    • UK
    • Spain
    • Poland
    • Russia
    • The Netherlands
    • Norway
    • Czech republic
    • The rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Indonesia
    • Malaysia
    • Thailand
    • Singapore
    • Australia and New Zealand
    • Rest of Asia-Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Rest of South America
  • The Middle East and Africa
    • Saudi Arabia
    • United Arab Emirates
    • South Africa
    • North Africa
    • Rest of MEA

The Binding Matrix Segment is expected to account for the largest market share, by type

By type, the chip bonding machine market is fragmented into flip chip bonder and die bonder. In 2021, Die bonder had the largest market share of 75.5% in the world die clamping machine market. The die bonding machine performs the process of attaching a die (or chip) to a substrate or package using epoxy or solder. The procedure begins with selecting a die from a wafer or wafer pack and laying it on the substrate in an exact position.

The emerging market for latest technologies, such as UHD televisions, hybrid laptops and smartphones, which have integrated circuits, is one of the major causes for the acceleration of the die bonder market. These products use multiple devices, such as optoelectronics, MEMS, and MOEMS, and chip bonding equipment is required in the assembly process of these components. Hence, the rise in electronics manufacturing is expected to drive the growth of the bonding matrix market. Additionally, increasing automotive automation is expected to drive the demand for embedded chips for a variety of tasks including ABS, airbag control, GPS, car navigation and display.

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Asia Pacific represents the highest CAGR over the forecast period

Die Fixing Machine Market is analyzed in North America, AsiaPacific, Europe, South America, Middle East and Africa. Globally, Asia-Pacific is estimated to hold the highest CAGR in the global die attaching machine market during the forecast period. Asia-Pacific includes China, India, Japan, South Korea and Rest of Asia-Pacific. China accounted for the major part of the die attaching machine market in Asia-Pacific in 2021, owing to strong economic growth in countries such as China, Japan, and India.

After Asia-Pacific, Europe is the fastest growing region with a CAGR of 5.5% in the global die attaching machine market. The region’s growing demand is met by large-scale end-use industries. Additionally, the communications sector has flourished in the region due to an increase in regulatory support for expansion. Such efforts support the expansion of the communications industry and, therefore, reflect the growth in demand for chip bonding materials over the next few years.

Leading Market Players in Global Die Fixing Machines Market

Most of the companies in the market are focused on expanding operations in all regions, increasing their capabilities, and building strong partnership relationships.

Leading players in the Global Die Fixing Machines Market are:

  • Dr Tresky SA
  • ASM Pacific Technology Limited
  • BE Semiconductor Industries SA
  • Anza Technology, Inc.
  • Inseto UK Limited
  • Fasford Technology Co. Limited
  • Kulicke and Soffa Industries, Inc.
  • Paloma Technologies
  • MicroAssembly Technologies Limited
  • Shinkawa Limited.

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